Laser module structure
文献类型：专利
| 作者 | MASUKO TAKAYUKI; IWAMA TAKEO |
| 发表日期 | 1990-12-11 |
| 专利号 | JP1990299281A |
| 著作权人 | 富士通株式会社 |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Laser module structure |
| 英文摘要 | PURPOSE:To enable a laser module to be mounted with a Peltier element keeping the laser module small in thickness as a whole and to improve it in performance by a method wherein an LD chip carrier is buried in a recess provided onto the upside of a board, the Peltier element is buried in another recess provided to the underside of the board, and the board is covered with a heat insulating material excluding its mounting part. CONSTITUTION:A recess 2 is provided to the upside of a board 8 an LD(laser diode) chip carrier 2 is buried in the recess 12 at a prescribed depth, the board 8 is supported from the base of a case 9, and a Peltier element 13 primarily for cooling the LD chip carrier 2 which releases heat is buried at a prescribed depth in a recess 14 formed on both the sides of the board 8 respectively. The upside of the board 8 excluding a part where the LD chip carrier 2 is mounted and the underside of the board 8 other than a part where the Peltier element 13 is provided are mostly covered with heat insulating materials 15 and 16. By this setup, a laser module can be not only mounted with a Peltier element keeping it small in thickness as a whole but also improved in performance. |
| 公开日期 | 1990-12-11 |
| 申请日期 | 1989-05-15 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/50557]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | 富士通株式会社 |
| 推荐引用方式 GB/T 7714 | MASUKO TAKAYUKI,IWAMA TAKEO. Laser module structure. JP1990299281A. 1990-12-11. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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