Electronic type cooling element built-in semiconductor laser assembly
文献类型：专利
| 作者 | GOTO MASAMI |
| 发表日期 | 1991-09-03 |
| 专利号 | JP1991201494A |
| 著作权人 | FUJITSU LTD |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Electronic type cooling element built-in semiconductor laser assembly |
| 英文摘要 | PURPOSE:To keep a semiconductor laser assembly stable in temperature and high in operation speed by a method wherein not only electrical wire connections are lessened in inductance but also an electronic type cooling element is apparently decreased in parasitic electrostatic capacity. CONSTITUTION:In a semiconductor laser assembly, an LD chip 26 is connected to assembly terminals 28 and 30 with wires 32 and 34 shortened in length. A capacitor 36 smaller than an equivalent electrostatic capacitor Co in capacity is added in series to the capacitor Co, whereby the resultant capacity becomes smaller than that of the capacitor 36, and a resonant frequency induced by the resultant electrostatic capacitor of the equivalent electrostatic capacitor Co and the capacitor 36 and the inductance of the wire 34 can be increased higher than a modulation frequency band. In result, an optical output can be prevented from being distorted in waveform, and a light source can be stabilized in temperature. |
| 公开日期 | 1991-09-03 |
| 申请日期 | 1989-12-28 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/50589]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | FUJITSU LTD |
| 推荐引用方式 GB/T 7714 | GOTO MASAMI. Electronic type cooling element built-in semiconductor laser assembly. JP1991201494A. 1991-09-03. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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