Connecting structure between semiconductor laser package and package for modulator
文献类型：专利
| 作者 | IWAMA TAKEO; NO SABURO |
| 发表日期 | 1992-03-31 |
| 专利号 | JP1992099081A |
| 著作权人 | FUJITSU LTD |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Connecting structure between semiconductor laser package and package for modulator |
| 英文摘要 | PURPOSE:To make the title connecting structure perfectly airtight and, at the same time, to efficiently couple the structure with the polarizing direction of a semiconductor laser module by connecting a package for mounting a modulator to a semiconductor laser package by laser-welding through an isolator. CONSTITUTION:Glass windows 22 and 23 are respectively installed to the front and rear faces of a package 2 for modulator incorporating an LN modulator 23. Then the package 2 is inserted into a flange 4 provided with a hole 41 into which the front face of the package 2 can be inserted. A glass window 11 through which laser light is outputted is provided to the front face of a semiconductor package The window in the front face of the package 1 and the front face of an isolator holder 3 housing an isolator 31 are faced to each other and laser-welded. After the rear face of the isolator 31 is positioned to the surface of the flange 4 where the package 2 is not inserted, the rear face of the isolator 31 is laser-welded to the flange 4 by the section encircled by the dotted line. |
| 公开日期 | 1992-03-31 |
| 申请日期 | 1990-03-20 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/50604]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | FUJITSU LTD |
| 推荐引用方式 GB/T 7714 | IWAMA TAKEO,NO SABURO. Connecting structure between semiconductor laser package and package for modulator. JP1992099081A. 1992-03-31. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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