中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Semiconductor laser device and assembly thereof

文献类型:专利

作者KATO TAKESHI; CHIBA KATSUAKI; MIZUISHI KENICHI
发表日期1992-01-22
专利号JP1992017383A
著作权人HITACHI LTD
国家日本
文献子类发明申请
其他题名Semiconductor laser device and assembly thereof
英文摘要PURPOSE:To improve workability of a wire bonding wiring of a semiconductor laser device by mutually shifting the opposing sides of the support bodies. CONSTITUTION:A superconductor laser chip 101 is set up on a supporting body (submount 103 and block 105) and a superconductor laser chip 102 is set up no a supporting body (submount 104 and block 106), the submounts 103 and 104 are provided with the projection conductors 107, 108 and the supporting bodies are set up on a base body by solder 109 and 110 so that fellow electrode sides of the semiconductors 101 and 102 may be parallel and opposing to mutually shift the opposing sides 133 and 134. Then, the semiconductor chip 101 is connected to an electrode terminal 119 by means of a wire 127, the part where the side 133 is not opposing to the side 134, a projection conductor 107 and a wire 129, while the semiconductor laser chip 102 is connected to an electrode terminal 118 by means of a wire 128, the part where the side 134 is not opposing to the side 133, the projection conductor 108 and a wire 130.
公开日期1992-01-22
申请日期1990-05-11
状态失效
源URL[http://ir.opt.ac.cn/handle/181661/50619]  
专题半导体激光器专利数据库
作者单位HITACHI LTD
推荐引用方式
GB/T 7714
KATO TAKESHI,CHIBA KATSUAKI,MIZUISHI KENICHI. Semiconductor laser device and assembly thereof. JP1992017383A. 1992-01-22.

入库方式: OAI收割

来源:西安光学精密机械研究所

浏览0
下载0
收藏0
其他版本

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。