Semiconductor laser device and assembly thereof
文献类型:专利
作者 | KATO TAKESHI; CHIBA KATSUAKI; MIZUISHI KENICHI |
发表日期 | 1992-01-22 |
专利号 | JP1992017383A |
著作权人 | HITACHI LTD |
国家 | 日本 |
文献子类 | 发明申请 |
其他题名 | Semiconductor laser device and assembly thereof |
英文摘要 | PURPOSE:To improve workability of a wire bonding wiring of a semiconductor laser device by mutually shifting the opposing sides of the support bodies. CONSTITUTION:A superconductor laser chip 101 is set up on a supporting body (submount 103 and block 105) and a superconductor laser chip 102 is set up no a supporting body (submount 104 and block 106), the submounts 103 and 104 are provided with the projection conductors 107, 108 and the supporting bodies are set up on a base body by solder 109 and 110 so that fellow electrode sides of the semiconductors 101 and 102 may be parallel and opposing to mutually shift the opposing sides 133 and 134. Then, the semiconductor chip 101 is connected to an electrode terminal 119 by means of a wire 127, the part where the side 133 is not opposing to the side 134, a projection conductor 107 and a wire 129, while the semiconductor laser chip 102 is connected to an electrode terminal 118 by means of a wire 128, the part where the side 134 is not opposing to the side 133, the projection conductor 108 and a wire 130. |
公开日期 | 1992-01-22 |
申请日期 | 1990-05-11 |
状态 | 失效 |
源URL | [http://ir.opt.ac.cn/handle/181661/50619] ![]() |
专题 | 半导体激光器专利数据库 |
作者单位 | HITACHI LTD |
推荐引用方式 GB/T 7714 | KATO TAKESHI,CHIBA KATSUAKI,MIZUISHI KENICHI. Semiconductor laser device and assembly thereof. JP1992017383A. 1992-01-22. |
入库方式: OAI收割
来源:西安光学精密机械研究所
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