Stem for semiconductor laser
文献类型：专利
| 作者 | ISHII MITSUO |
| 发表日期 | 1992-03-11 |
| 专利号 | JP1992076971A |
| 著作权人 | MITSUBISHI ELECTRIC CORP |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Stem for semiconductor laser |
| 英文摘要 | PURPOSE:To prevent a solder from creeping up on an inclined stand and from adhering to the surface of a PD chip by a method wherein a groove is formed in a part where the following are crossed: the side face where the inclined stand, to which a PD submount is attached and which is situated nearly in the center of a stem, is bonded to a block for heat-dissipating use; and the surface of the stem. CONSTITUTION:A groove 8 used to store a solder is formed in a part where the following are crossed: the side face where a block 3 for heat-dissipating use is bonded to an inclined stand, of a stem, to which a PD chip and a PD submount 5 are attached; and the surface of the stem 6. Thereby, when the block 3 for heat-dissipating use is pushed to the inclined stand 7 and is soldered to the stem, the solder flows into the groove 8. Consequently, it is possible to eliminate a short circuit caused when the solder adheres to the side face of the PD chip 4 and the PD submount 5 to be electrically insulated which are bonded to the inclined stand 7. When the groove 8 is formed, the block 3 for heat-dissipating use is bonded to the surface of the stem 6 and to the side face of the inclined stand 7; the central position accuracy of the stem 6 with reference to an LD chip 1 is enhanced. |
| 公开日期 | 1992-03-11 |
| 申请日期 | 1990-07-18 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/50631]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | MITSUBISHI ELECTRIC CORP |
| 推荐引用方式 GB/T 7714 | ISHII MITSUO. Stem for semiconductor laser. JP1992076971A. 1992-03-11. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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