Heat sink of semiconductor device
文献类型：专利
| 作者 | UEHARA KUNIO |
| 发表日期 | 1992-03-30 |
| 专利号 | JP1992097581A |
| 著作权人 | NEC CORP |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Heat sink of semiconductor device |
| 英文摘要 | PURPOSE:To realize semiconductor layer chip mounting configuration where the length of a wire is 0.3mm by removing the difference in the levels of the faces, which are connected by the bonding wire, of a semiconductor laser chip and a heat sink. CONSTITUTION:A semiconductor chip 2 is fused together to a heat sink l, and the p-type electrode 21 of the semiconductor chip is coupled with the metallic film 12, which is formed on the surface of the part projecting from the surface where the semiconductor chip is fused together, by a bonding wire 3 The difference in the levels of the p-type electrode face 21 of the semiconductor layer chip and the face 12 coupled by the bonding wire 31 are removed, therefore the length of the wire can be made 0.3mm or less. |
| 公开日期 | 1992-03-30 |
| 申请日期 | 1990-08-15 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/50638]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | NEC CORP |
| 推荐引用方式 GB/T 7714 | UEHARA KUNIO. Heat sink of semiconductor device. JP1992097581A. 1992-03-30. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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