Light element module semiconductor device
文献类型：专利
| 作者 | CHINEN YUKIO |
| 发表日期 | 1992-04-24 |
| 专利号 | JP1992124891A |
| 著作权人 | TOSHIBA CORP |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Light element module semiconductor device |
| 英文摘要 | PURPOSE:To enable simple loading to a printed wiring board and impedance control by providing a plurality of striped electrodes which protrude by the predetermined length from the insulated area at the side surface of package in the same direction as the approaching direction of an insulated substrate and supplying the power to a light element in the package and to the peripheral parts thereof. CONSTITUTION:A square type package 1 and an optical fiber 2 are fixed by a fiber holder 3, a heat sink 5 is formed on the rear side of the package 1 and elements are comprised within the package Sealing and electrical insulation are realized by providing an insulating material using alumina on the side of bottom surface of the side surfaces of the package 1 and electrodes are wired in the package 1 through this insulation area 8. An insulating plate 6 using alumina is approached from both side surfaces of the package 1 in perpendicular to the insulating area 8 and a striped electrode 7 is formed on the upper surface of this insulating plate 6. The striped electrode 7 is connected with the electrode guided from the package 1 through the insulating area 8 on the side surfaces of the package a. The end part of striped electrode 7 is located in the side section of the insulating plate 6. |
| 公开日期 | 1992-04-24 |
| 申请日期 | 1990-09-14 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/50645]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | TOSHIBA CORP |
| 推荐引用方式 GB/T 7714 | CHINEN YUKIO. Light element module semiconductor device. JP1992124891A. 1992-04-24. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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