Semiconductor laser equipment
文献类型：专利
| 作者 | ISHII MITSUO |
| 发表日期 | 1992-11-20 |
| 专利号 | JP1992334081A |
| 著作权人 | MITSUBISHI ELECTRIC CORP |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Semiconductor laser equipment |
| 英文摘要 | PURPOSE:To prevent that, when a metal block for heat dissipation is made to abut against a slant stand in the central part of a package and soldered, the solder runs on the slant stand and sticks to the side surface of a PD submount. CONSTITUTION:A groove 12 is formed at a portion where a side surface 8 of a slant stand 7 of a package 6 on which stand a PD chip 4 and a PD submount 5 are fixed and a mounting surface 9 of a package 6 which surface is made to abut against the side surface 8 and soldered intersect with each other. When a metal block for heat dissipation is made abut against the side surface of the slant stand and bonded to the mounting surface of the package by using solder, said solder which has conventionally runs on the slant stand flows into the groove. Thereby short-circuit due to solder sticking on the PD mount side surface can be prevented. |
| 公开日期 | 1992-11-20 |
| 申请日期 | 1991-05-09 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/50700]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | MITSUBISHI ELECTRIC CORP |
| 推荐引用方式 GB/T 7714 | ISHII MITSUO. Semiconductor laser equipment. JP1992334081A. 1992-11-20. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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