Method of mounting an optical device and mounting therefor
文献类型：专利
| 作者 | HIROSHI, HONMOU; ISAO, YONEDA; JUNICHI, SASAKI; MASATAKA, ITOH |
| 发表日期 | 1998-08-19 |
| 专利号 | GB2322234A |
| 著作权人 | NEC CORPORATION |
| 国家 | 英国 |
| 文献子类 | 发明申请 |
| 其他题名 | Method of mounting an optical device and mounting therefor |
| 英文摘要 | A method of mounting an optical device such as a semiconductor laser 8 includes the steps of punching a metal foil (3), e.g. of AuSn a fine punch. The punch repeatedly punches the metal foil to provide a plurality of pieces of metal foil 3a, smaller in diameter than a metal pad 5 on a substrate 4, which are stacked on the metal pad in the form of a laminate. After an optical device 8 having a metal pad 7 has been temporarily placed on top of the laminate, the laminate is melted to provide a fine bonding lump between the optical device 8 and the substrate. |
| 公开日期 | 1998-08-19 |
| 申请日期 | 1998-02-10 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/51157]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | NEC CORPORATION |
| 推荐引用方式 GB/T 7714 | HIROSHI, HONMOU,ISAO, YONEDA,JUNICHI, SASAKI,et al. Method of mounting an optical device and mounting therefor. GB2322234A. 1998-08-19. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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