Semiconductor laser device and a method of mounting a semiconductor laser component on a submount
文献类型：专利
| 作者 | MOCHIDA, ATUHITO; INOUE, HIROTO; NAKAO, SUGURU; IWATA, YUKIHIRO; TAKAMORI, AKIRA; ADACHI, HIDETO; TAMURA, MASATOSHI; MOCHIDA, KOREKAZU; MOCHIDA, KYOKO |
| 发表日期 | 2006-08-03 |
| 专利号 | US20060171434A1 |
| 著作权人 | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Semiconductor laser device and a method of mounting a semiconductor laser component on a submount |
| 英文摘要 | The present invention provides a method of mounting a semiconductor laser component capable of preventing deterioration of laser characteristics and destruction of the semiconductor laser component due to a rise in temperature and a residual stress of the semiconductor laser component, wherein the semiconductor laser component is mounted on a submount by heating and pressure-bonding, and is heated again up to a temperature more than a melting point of a bonding member at the released pressure to release the residual stress. |
| 公开日期 | 2006-08-03 |
| 申请日期 | 2003-07-30 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/51383]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
| 推荐引用方式 GB/T 7714 | MOCHIDA, ATUHITO,INOUE, HIROTO,NAKAO, SUGURU,et al. Semiconductor laser device and a method of mounting a semiconductor laser component on a submount. US20060171434A1. 2006-08-03. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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