Laser diode package utilizing a laser diode stack
文献类型：专利
| 作者 | DEFRANZA, MARK JOSEPH; DAWSON, DAVID CLIFFORD; FARMER, JASON NATHANIEL |
| 发表日期 | 2007-09-20 |
| 专利号 | US20070217467A1 |
| 著作权人 | NLIGHT PHOTONICS CORPORATION |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Laser diode package utilizing a laser diode stack |
| 英文摘要 | A laser diode package is provided. The laser diode package includes a plurality of laser diode submount assemblies, each assembly including a submount to which one or more laser diodes are attached. An electrically isolating pad is attached to the same surface of the submount as the laser diode. A metallization layer is deposited onto the outermost surface of the electrically isolating pad, to which an electrical contact pad is bonded. Electrical interconnects, such as wire or ribbon interconnects, connect the laser diode or diodes to the metallization layer. Preferably the laser diode stack is formed by electrically and mechanically bonding together the bottom surface of each submount to the electrical contact pad of an adjacent submount assembly. The laser diode stack is thermally coupled to a cooling block. Preferably thermally conductive and electrically isolating members are interposed between the laser diode stack and the cooling block. |
| 公开日期 | 2007-09-20 |
| 申请日期 | 2006-03-20 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/51525]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | NLIGHT PHOTONICS CORPORATION |
| 推荐引用方式 GB/T 7714 | DEFRANZA, MARK JOSEPH,DAWSON, DAVID CLIFFORD,FARMER, JASON NATHANIEL. Laser diode package utilizing a laser diode stack. US20070217467A1. 2007-09-20. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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