Heat dissipating assembly
文献类型：专利
| 作者 | HORNG, ALEX; KUO, CHI-HUNG; CHUNG, CHIH-HAO |
| 发表日期 | 2012-10-10 |
| 专利号 | EP2388812A3 |
| 著作权人 | SUNONWEALTH ELECTRIC MACHINE INDUSTRY CO., LTD. |
| 国家 | 欧洲专利局 |
| 文献子类 | 发明申请 |
| 其他题名 | Heat dissipating assembly |
| 英文摘要 | A heat dissipating assembly includes a circuit board (1) having opposite first and second faces (11, 12). The circuit board (1) further includes a through-hole (13) extending from the first face (11) through the second face (12). A heat generating element (2) is mounted on the first face (11) of the circuit board (1) and electrically coupled to the circuit board (1). The heat generating element (2) includes a heat conducting portion (22) aligned with the through-hole (13). A heat dissipating unit (3) includes a base (31) having an engaging face (311) in contact with the second face (12) of the circuit board (1). A heat conducting adhesive (4) is filled in the through-hole (13). The heat conducting adhesive (4) is engaged with the engaging face (311) of the base (31) and the heat conducting portion (22) of the heat generating element (2). The heat generating element (2) is directly engaged with the heat dissipating unit (3) by the heat conducting adhesive (4) to effectively enhance the overall heat dissipating efficiency while reducing the number of members to lower the manufacturing costs. |
| 公开日期 | 2012-10-10 |
| 申请日期 | 2010-10-06 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/51689]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SUNONWEALTH ELECTRIC MACHINE INDUSTRY CO., LTD. |
| 推荐引用方式 GB/T 7714 | HORNG, ALEX,KUO, CHI-HUNG,CHUNG, CHIH-HAO. Heat dissipating assembly. EP2388812A3. 2012-10-10. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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