Laser module with simplified alignment
文献类型：专利
| 作者 | GRONENBORN, STEPHAN; HEUSLER, GERO; CONRADS, RALF GORDON; MOENCH, HOLGER |
| 发表日期 | 2015-06-25 |
| 专利号 | WO2015091117A1 |
| 著作权人 | KONINKLIJKE PHILIPS N.V. |
| 国家 | 世界知识产权组织 |
| 文献子类 | 发明申请 |
| 其他题名 | Laser module with simplified alignment |
| 英文摘要 | The invention describes carrier structure (100, 200) for assembling a semiconductor lighting module, comprising at least two sub carriers (110, 210) and an alignment structure (120, 130, 230, 232) mechanically coupling the sub carriers (110, 210). The alignment structure (120, 130, 230, 232) is adapted such that the mechanical coupling to at least a part of the sub carriers (110, 210) disappears during thermal mating the carrier structure (100, 200) on a carrier (110, 250). The alignment structure (120, 130, 230, 232) is further adapted to compensate a coefficient of thermal expansion of a material of the carrier (110, 250) being higher than a coefficient of thermal expansion of a material of the carrier structure (100, 200). The invention further describes a semiconductor chip comprising such a carrier structure (100, 200) and a semiconductor lighting module comprising the carrier structure (100, 200) or the semiconductor chip. The invention finally describes a corresponding method of manufacturing a semiconductor lighting module. The invention enables assembling of semiconductor lighting modules by thermal mating with reduced alignment effort. |
| 公开日期 | 2015-06-25 |
| 申请日期 | 2014-12-10 |
| 状态 | 未确认 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/51717]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | KONINKLIJKE PHILIPS N.V. |
| 推荐引用方式 GB/T 7714 | GRONENBORN, STEPHAN,HEUSLER, GERO,CONRADS, RALF GORDON,et al. Laser module with simplified alignment. WO2015091117A1. 2015-06-25. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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