Bonding semiconductive bodies
文献类型：专利
| 作者 | ADRIAN, PERRIN, JANSSEN; JENNIFER, KAREN, STONE; RALPH, BARTON, DEAN; ARTHUR, WALKER |
| 发表日期 | 1984-10-03 |
| 专利号 | GB2137131A |
| 著作权人 | STANDARD TELEPHONES AND CABLES PUBLIC LIMITED COMPANY |
| 国家 | 英国 |
| 文献子类 | 发明申请 |
| 其他题名 | Bonding semiconductive bodies |
| 英文摘要 | Reproduceability and reliability problems associated with using a solder perform to bond a semiconductor laser chip (1) to a heat sink (2) are avoided by a diffusion associated bonding method. Both surfaces to be bonded are coated with relatively thick layers of gold (3, 7), one or both of which is/are then coated with a submicron thickness tin layer (5) whose surface is, if required, protected from oxidation with a further coating (6) of gold. The two components are assembled and heated to bond them together by causing a molten gold-tin eutectic layer to be formed which then diffuses into the gold layers without penetrating right through them. |
| 公开日期 | 1984-10-03 |
| 申请日期 | 1983-03-15 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/51793]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | STANDARD TELEPHONES AND CABLES PUBLIC LIMITED COMPANY |
| 推荐引用方式 GB/T 7714 | ADRIAN, PERRIN, JANSSEN,JENNIFER, KAREN, STONE,RALPH, BARTON, DEAN,et al. Bonding semiconductive bodies. GB2137131A. 1984-10-03. |
入库方式： OAI收割
来源：西安光学精密机械研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。