Optical device and package for optical device.
文献类型：专利
| 作者 | NISHIZAWA, HIDEAKI |
| 发表日期 | 1985-05-22 |
| 专利号 | FI844473A |
| 著作权人 | SUMITOMO ELECTRIC INDUSTRIES,LTD |
| 国家 | 芬兰 |
| 文献子类 | 发明申请 |
| 其他题名 | Optical device and package for optical device. |
| 英文摘要 | In packaging an optical device 61 on a sapphire substrate 21 the substrate is cut away to form a depression 52 having inclined sides 51 so that edges of an electroconductive paste 54 located on the inclined sides 51 does not protrude above the remainder of the paste 54 even after firing to provide a substantially flat die bonding pad 23. The optical device 61 has a thin solder layer 66 applied to its electrode 65 surrounding a light transmitting surface 67 of the device and this thin solder layer 66 is used to mount the device 61 on the die bonding pad 23. |
| 公开日期 | 1985-05-22 |
| 申请日期 | 1984-11-14 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/51807]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SUMITOMO ELECTRIC INDUSTRIES,LTD |
| 推荐引用方式 GB/T 7714 | NISHIZAWA, HIDEAKI. Optical device and package for optical device.. FI844473A. 1985-05-22. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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