Cooling structures and package modules for semiconductors
文献类型：专利
| 作者 | UNGER PETER; VETTIGER PETER; BUCHMANN PETER L; BUCHMANN, PETER; VOEGELI OTTO |
| 发表日期 | 1992-11-04 |
| 专利号 | CA2065980A1 |
| 著作权人 | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 国家 | 加拿大 |
| 文献子类 | 发明申请 |
| 其他题名 | Cooling structures and package modules for semiconductors |
| 英文摘要 | SZ9-90-016 COOLING STRUCTURES AND PACKAGE MODULES FOR SEMICONDUCTORS ABSTRACT Cooling structure for direct heat transfer between an activelayer of a chip in which electric elements are formed and aheat sink. The inventive cooling structure consists of acurrent/voltage supply level with metal structures andinsulation spacers and/or layers, partly covered by aninsulation layer and followed by a heat transfer structure.A heat transfer bridge in thermal connection to the heattransfer structure provides for heat flux between theinventive cooling structure and the heat sink. |
| 公开日期 | 1992-11-04 |
| 申请日期 | 1992-04-14 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/51927]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 推荐引用方式 GB/T 7714 | UNGER PETER,VETTIGER PETER,BUCHMANN PETER L,et al. Cooling structures and package modules for semiconductors. CA2065980A1. 1992-11-04. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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