中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Packaging platform, optical module using the platform, and methods for producing the platform and the module

文献类型:专利

作者AMANO, MICHIYUKI, C/O NIPPON TELEG. AND TEL. CORP.; TONO, SHUNICHI, C/O NIPPON TELEG. AND TEL. CORP.; SATO, HIROTSUGU, C/O NIPPON TELEG. AND TEL. CORP.; TAMURA, YASUAKI, C/O NIPPON TELEG. AND TEL. CORP.; SHUTO, YOSHITO, C/O NIPPON TELEG. AND TEL. CORP.; YOKOYAMA, KENJI, C/O NIPPON TELEG. AND TEL. CORP.; KOZAWAGUCHI, HARUKI, C/O NIPPON TELEG.& TEL. CORP.; HIKITA, MAKOTO, C/O NIPPON TELEGRAPH & TEL. CORP.; YOSHIMURA, RYOKO, C/O NIPPON TELEG. & TEL. CORP.; TOMARU, SATORU, C/O NIPPON TELEG. & TEL. CORP.
发表日期1998-09-16
专利号EP0864893A2
著作权人NIPPON TELEGRAPH AND TELEPHONE CORPORATION
国家欧洲专利局
文献子类发明申请
其他题名Packaging platform, optical module using the platform, and methods for producing the platform and the module
英文摘要A packaging platform (11, 21, 33, 61) for optically coupling one or more optical waveguides of one or more optical components (15, 22, 31, 65) having the optical waveguide to one or more optical fibers is provided with a reference structure portion (31-10a, 31-10b, 33-10a, 33-10b, 33-6, 80-10a, 80-10c, 80-10d) for the horizontal and vertical positioning of the optical component (15, 22, 31, 65) and one or more fiber positioning portions (33-1) for inserting and holding the optical fiber and positioning the optical fiber at a position where the optical fiber is optically connected to the optical waveguide; whereby the packaging platform (11, 21, 33, 61) and an optical module using the platform are provided which can simplify all alignment steps for optical coupling, electrical connection and sealing in the coupling of the optical component and the optical fiber.
公开日期1998-09-16
申请日期1998-03-12
状态失效
源URL[http://ir.opt.ac.cn/handle/181661/52130]  
专题半导体激光器专利数据库
作者单位NIPPON TELEGRAPH AND TELEPHONE CORPORATION
推荐引用方式
GB/T 7714
AMANO, MICHIYUKI, C/O NIPPON TELEG. AND TEL. CORP.,TONO, SHUNICHI, C/O NIPPON TELEG. AND TEL. CORP.,SATO, HIROTSUGU, C/O NIPPON TELEG. AND TEL. CORP.,et al. Packaging platform, optical module using the platform, and methods for producing the platform and the module. EP0864893A2. 1998-09-16.

入库方式: OAI收割

来源:西安光学精密机械研究所

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