Packaging platform, optical module using the platform, and methods for producing the platform and the module
文献类型:专利
作者 | AMANO, MICHIYUKI, C/O NIPPON TELEG. AND TEL. CORP.; TONO, SHUNICHI, C/O NIPPON TELEG. AND TEL. CORP.; SATO, HIROTSUGU, C/O NIPPON TELEG. AND TEL. CORP.; TAMURA, YASUAKI, C/O NIPPON TELEG. AND TEL. CORP.; SHUTO, YOSHITO, C/O NIPPON TELEG. AND TEL. CORP.; YOKOYAMA, KENJI, C/O NIPPON TELEG. AND TEL. CORP.; KOZAWAGUCHI, HARUKI, C/O NIPPON TELEG.& TEL. CORP.; HIKITA, MAKOTO, C/O NIPPON TELEGRAPH & TEL. CORP.; YOSHIMURA, RYOKO, C/O NIPPON TELEG. & TEL. CORP.; TOMARU, SATORU, C/O NIPPON TELEG. & TEL. CORP. |
发表日期 | 1998-09-16 |
专利号 | EP0864893A2 |
著作权人 | NIPPON TELEGRAPH AND TELEPHONE CORPORATION |
国家 | 欧洲专利局 |
文献子类 | 发明申请 |
其他题名 | Packaging platform, optical module using the platform, and methods for producing the platform and the module |
英文摘要 | A packaging platform (11, 21, 33, 61) for optically coupling one or more optical waveguides of one or more optical components (15, 22, 31, 65) having the optical waveguide to one or more optical fibers is provided with a reference structure portion (31-10a, 31-10b, 33-10a, 33-10b, 33-6, 80-10a, 80-10c, 80-10d) for the horizontal and vertical positioning of the optical component (15, 22, 31, 65) and one or more fiber positioning portions (33-1) for inserting and holding the optical fiber and positioning the optical fiber at a position where the optical fiber is optically connected to the optical waveguide; whereby the packaging platform (11, 21, 33, 61) and an optical module using the platform are provided which can simplify all alignment steps for optical coupling, electrical connection and sealing in the coupling of the optical component and the optical fiber. |
公开日期 | 1998-09-16 |
申请日期 | 1998-03-12 |
状态 | 失效 |
源URL | [http://ir.opt.ac.cn/handle/181661/52130] ![]() |
专题 | 半导体激光器专利数据库 |
作者单位 | NIPPON TELEGRAPH AND TELEPHONE CORPORATION |
推荐引用方式 GB/T 7714 | AMANO, MICHIYUKI, C/O NIPPON TELEG. AND TEL. CORP.,TONO, SHUNICHI, C/O NIPPON TELEG. AND TEL. CORP.,SATO, HIROTSUGU, C/O NIPPON TELEG. AND TEL. CORP.,et al. Packaging platform, optical module using the platform, and methods for producing the platform and the module. EP0864893A2. 1998-09-16. |
入库方式: OAI收割
来源:西安光学精密机械研究所
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