Method and apparatus for packaging high frequency components
文献类型：专利
| 作者 | WILLIAMSON ROBERT S. III; MARSLAND ROBERT A. |
| 发表日期 | 2002-08-15 |
| 专利号 | WO2001046991A8 |
| 著作权人 | MARSLAND ROBERT A |
| 国家 | 世界知识产权组织 |
| 文献子类 | 发明申请 |
| 其他题名 | Method and apparatus for packaging high frequency components |
| 英文摘要 | The invention provides a method and apparatus for packaging high frequency electrical and/or electro-optical components. The package (140) may be surface mounted on a board with other electrical components. The shielding provided by the package minimizes electromagnetic interference with other electrical components on the board. The package includes a controlled impedance I/O interface for coupling with the electrical or electro-optical components in the package. The interface may also include a differential I/O capability to further control electromagnetic fields generated at the interface. Additionally, the package may include an optical link provided by one or more optical fibers (150) extending from the package. These features allow the package to be used for a variety of high frequency components including optical transmitters (254) and optical receivers. A method for fabricating the package is also disclosed. The package may be fabricated with relatively low cost and a reduced form factor as compared with prior art packages. |
| 公开日期 | 2002-08-15 |
| 申请日期 | 2000-12-12 |
| 状态 | 未确认 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/52319]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | MARSLAND ROBERT A |
| 推荐引用方式 GB/T 7714 | WILLIAMSON ROBERT S. III,MARSLAND ROBERT A.. Method and apparatus for packaging high frequency components. WO2001046991A8. 2002-08-15. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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