Method and apparatus for providing optical interconnection
文献类型:专利
作者 | PANICCIA, MARIO J.; MORSE, MICHAEL T.; RAO, VALLURI R.M. |
发表日期 | 2001-10-18 |
专利号 | US20010031109A1 |
著作权人 | INTEL CORPORATION |
国家 | 美国 |
文献子类 | 发明申请 |
其他题名 | Method and apparatus for providing optical interconnection |
英文摘要 | A method and an apparatus providing an optical interconnection in an integrated circuit die. In one embodiment, an optical interconnection is used to optically interconnect a waveguide-based optical modulator through the insulating layer and back side of the semiconductor substrate of the integrated circuit die. In one embodiment, an insulating oxide layer is disposed between a semiconductor waveguide optical modulator and the back side of the semiconductor substrate. Optical conduits are disposed in the insulating oxide layer at the locations where light enters and exits the semiconductor waveguide optical modulator. In one embodiment, the optical conduits have indexes of refraction substantially equal to the indexes of refraction of the semiconductor substrate and the semiconductor waveguide optical modulator. Thus, attenuation of the light used to optically couple the semiconductor waveguide optical modulator through the back side of the semiconductor substrate is reduced. |
公开日期 | 2001-10-18 |
申请日期 | 2001-02-09 |
状态 | 失效 |
源URL | [http://ir.opt.ac.cn/handle/181661/52353] ![]() |
专题 | 半导体激光器专利数据库 |
作者单位 | INTEL CORPORATION |
推荐引用方式 GB/T 7714 | PANICCIA, MARIO J.,MORSE, MICHAEL T.,RAO, VALLURI R.M.. Method and apparatus for providing optical interconnection. US20010031109A1. 2001-10-18. |
入库方式: OAI收割
来源:西安光学精密机械研究所
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