Attachment of a heat spreader for fabricating a cavity down plastic chip carrier
文献类型：专利
| 作者 | TUNG, I-CHUNG; HSU, SHIH-PING |
| 发表日期 | 2002-09-12 |
| 专利号 | US20020124955A1 |
| 著作权人 | PHOENIX PRECISION TECHNOLOGY CORPORATION |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Attachment of a heat spreader for fabricating a cavity down plastic chip carrier |
| 英文摘要 | A heat spreader attachment method for making a cavity down plastic chip carrier devoid of warpage and twist is disclosed. A bonding sheet is used to bond a circuit substrate and a heat spreader. The bonding sheet is made of a single adhesive layer or a stacking of more adhesive layers. The adhesive layer is made of an adhesive material, or a flake-filled adhesive material, or fiber-filled adhesive material, or a particle-filled adhesive material. The circuit substrate possesses an opening to receive an electrionic chip. |
| 公开日期 | 2002-09-12 |
| 申请日期 | 2001-03-08 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/52378]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | PHOENIX PRECISION TECHNOLOGY CORPORATION |
| 推荐引用方式 GB/T 7714 | TUNG, I-CHUNG,HSU, SHIH-PING. Attachment of a heat spreader for fabricating a cavity down plastic chip carrier. US20020124955A1. 2002-09-12. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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