Thermal management systems and methods
文献类型：专利
| 作者 | HIGGINS, ROBERT J. |
| 发表日期 | 2003-01-30 |
| 专利号 | US20030020072A1 |
| 著作权人 | MOTOROLA, INC. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Thermal management systems and methods |
| 英文摘要 | A thermal management system or method may include features for pumping heat in a composite semiconductor structure. A heat pump such as a peltier device may be formed from compound semiconductor materials in a composite semiconductor structure. The heat pump may be thermally connected to an area of thermal interest such as a circuit device that generates heat during operation. The heat pump may also be connected to a non-compound semiconductor region of the composite semiconductor structure, which may be die bonded to a heat sink. Electricity may be conducted through the heat pump to move heat in a desired direction between the area of thermal interest and the non-compound semiconductor region. Plural heat pumps may be formed for cooling or heating an area of thermal interest in the composite semiconductor structure. If desired, control circuitry and a temperature sensor may be formed and used to regulate the temperature in the area of the thermal interest. |
| 公开日期 | 2003-01-30 |
| 申请日期 | 2001-07-25 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/52488]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | MOTOROLA, INC. |
| 推荐引用方式 GB/T 7714 | HIGGINS, ROBERT J.. Thermal management systems and methods. US20030020072A1. 2003-01-30. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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