Heat radiator for electronic device and method of making it
文献类型：专利
| 作者 | SUZUKI, KATSUNORI; IIJIMA, KENZABUROU; HOSHI, TOSHIHARU |
| 发表日期 | 2002-04-18 |
| 专利号 | US20020043364A1 |
| 著作权人 | YAMAHA CORPORATION |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Heat radiator for electronic device and method of making it |
| 英文摘要 | A heat radiator for dissipating heat from an electronic device, which is mounted on a board or which is installed in a casing, to the outside thereof is basically composed of a substrate having plenty of through holes, which are produced by press molding and sintering. The substrate having a low thermal expansion coefficient is made of a copper-tungsten alloy or a copper-molybdenum alloy in which the copper content is smaller than the tungsten content or molybdenum content. The through holes each having a circular shape or a rectangular shape are infiltrated with the compound having a high thermal conductivity and composed of a copper-tungsten alloy or a copper-molybdenum alloy in which the copper content is greater than the tungsten content or molybdenum content. Thus, the heat radiator allows thermal conduction along axial directions of the through holes while substantially avoiding unwanted thermal expansion thereof |
| 公开日期 | 2002-04-18 |
| 申请日期 | 2001-10-16 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/52558]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | YAMAHA CORPORATION |
| 推荐引用方式 GB/T 7714 | SUZUKI, KATSUNORI,IIJIMA, KENZABUROU,HOSHI, TOSHIHARU. Heat radiator for electronic device and method of making it. US20020043364A1. 2002-04-18. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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