Laser diode module and mounting board
文献类型：专利
| 作者 | KATO, TOMOYA; SHIMIZU, TAKEO; IWASE, MASAYUKI; MURATA, HIDEAKI |
| 发表日期 | 2002-04-25 |
| 专利号 | US20020048295A1 |
| 著作权人 | FURUKAWA ELECTRIC CO., LTD., THE |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Laser diode module and mounting board |
| 英文摘要 | A laser diode module of the invention can release heat radiated from a laser diode efficiently, and is of small size and small power consumption. An outer surface (15) of a bottom plate (2) of a package (7) is formed to be a board mounting surface to be mounted on a printed board (20). A base (6) is fixed to the inner wall surface (9) side of the top plate (8) of the package (7) and a laser diode (3) is fixed to the base (6). In the invention, an exemplary configuration where heat radiated from the laser diode is released effectively is formed by disposing a heat radiating unit (4) on the outer surface (16) side of the top plate (8) of the package (7), for example. The heat radiating unit (4) is formed by disposing a plurality of heat radiating fins (5) arranged at intervals, for example. The configuration containing the heat radiating unit (4) releases heat radiated from the laser diode (3) through the base (6), the top plate (8) and the heat radiating unit (4). |
| 公开日期 | 2002-04-25 |
| 申请日期 | 2001-10-17 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/52560]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | FURUKAWA ELECTRIC CO., LTD., THE |
| 推荐引用方式 GB/T 7714 | KATO, TOMOYA,SHIMIZU, TAKEO,IWASE, MASAYUKI,et al. Laser diode module and mounting board. US20020048295A1. 2002-04-25. |
入库方式： OAI收割
来源：西安光学精密机械研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。