Method and apparatus for packaging laser diodes
文献类型：专利
| 作者 | DHARIA, KIRIT S.; FRANKS, ROBERT; GONTIJO, IVAIR; GUO, JUNPENG; LIU, YET-ZEN; PANICKER, M.P. RAMACHANDRA; YU, RUAI |
| 发表日期 | 2003-04-24 |
| 专利号 | US20030076861A1 |
| 著作权人 | GTRAN INC. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Method and apparatus for packaging laser diodes |
| 英文摘要 | A system and apparatus for packaging a laser diode is provided according to the present invention. It includes a solid structure having a first cavity, wherein the first cavity receives a fiber pipe with optical fiber, which is aligned to the laser diode. The solid structure also includes a recess that receives the fiber pipe; and a step for receiving a sealing ring. The solid structure is multi-layered and may be manufactured from ceramic material, beryllium oxide or aluminum nitride. The solid structure includes a second cavity that accommodates a fiber alignment mechanism; a sub-mount on which the laser diode is placed; and/or heat sink used for conducting heat from the laser diode. |
| 公开日期 | 2003-04-24 |
| 申请日期 | 2001-10-19 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/52564]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | GTRAN INC. |
| 推荐引用方式 GB/T 7714 | DHARIA, KIRIT S.,FRANKS, ROBERT,GONTIJO, IVAIR,et al. Method and apparatus for packaging laser diodes. US20030076861A1. 2003-04-24. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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