Small scale chip cooler assembly
文献类型：专利
| 作者 | COSLEY, MICHAEL R.; FISCHER, RICHARD L.; THIESEN, JACK H.; WILLEN, GARY S. |
| 发表日期 | 2003-07-17 |
| 专利号 | US20030131972A1 |
| 著作权人 | EMERSON NETWORK POWER, ENERGY SYSTEMS, NORTH AMERICA, INC. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Small scale chip cooler assembly |
| 英文摘要 | A microscale chip cooling system for a heat dissipating item, such as Intel's Pentium brand microprocessor, is disclosed. The system includes a 40 millimeter by 40 millimeter thermally insulated housing including a base and a cover and the system also includes a thermally conductive evaporator. The evaporator is adapted to be attached to a heat source such as the microprocessor. The cover includes inlet and outlet ports and the base includes a capillary passage. A refrigerant or heat transferring fluid is pumped or past through the passage before making a sudden expansion in an expansion zone just before passing to an evaporator chamber. Pool and flow boiling and forced convection may occur in the evaporator chamber as heat is transferred from the microprocessor through the thermally conductive evaporator to the refrigerant. The refrigerant then returns to a compressor to repeat the cycle. The system is extremely small and very efficient. |
| 公开日期 | 2003-07-17 |
| 申请日期 | 2002-01-14 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/52614]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | EMERSON NETWORK POWER, ENERGY SYSTEMS, NORTH AMERICA, INC. |
| 推荐引用方式 GB/T 7714 | COSLEY, MICHAEL R.,FISCHER, RICHARD L.,THIESEN, JACK H.,et al. Small scale chip cooler assembly. US20030131972A1. 2003-07-17. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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