Electronic module including a cooling substrate and related methods
文献类型：专利
| 作者 | LANGE, MICHAEL; NEWTON, CHARLES; SNYDER, STEVEN |
| 发表日期 | 2003-03-27 |
| 专利号 | AU2002254176A1 |
| 著作权人 | HARRIS CORPORATION |
| 国家 | 澳大利亚 |
| 文献子类 | 发明申请 |
| 其他题名 | Electronic module including a cooling substrate and related methods |
| 英文摘要 | An electronic module (20) includes a cooling substrate (21a), an electronic device (22) mounted thereon, and a heat sink (23) adjacent the cooling substrate (21a). More particularly, the cooling substrate (21a) may have an evaporator chamber (25) adjacent the electronic device (22), at least one condenser chamber (26) adjacent the heat sink (23), and at least one cooling fluid passageway (27) connecting the evaporator chamber (25) in fluid communication with the at least one condenser chamber (26). Furthermore, an evaporator thermal transfer body (28) may be connected in thermal communication between the evaporator chamber (25) and the electronic device (22). Additionally, at least one condenser thermal transfer body (36) may be connected in thermal communication between the at least one condenser chamber (26) and the heat sink (23). The evaporator thermal transfer body (28) and the at least one condenser thermal transfer body (36) preferably each have a higher thermal conductivity than adjacent cooling substrate portions. |
| 公开日期 | 2003-03-27 |
| 申请日期 | 2002-03-12 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/52667]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | HARRIS CORPORATION |
| 推荐引用方式 GB/T 7714 | LANGE, MICHAEL,NEWTON, CHARLES,SNYDER, STEVEN. Electronic module including a cooling substrate and related methods. AU2002254176A1. 2003-03-27. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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