Laser welding method and semiconductor laser module manufactured by this method
文献类型：专利
| 作者 | SEKIGUCHI, KAORU |
| 发表日期 | 2002-12-26 |
| 专利号 | US20020195432A1 |
| 著作权人 | FURUKAWA ELECTRIC CO., LTD, THE |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Laser welding method and semiconductor laser module manufactured by this method |
| 英文摘要 | When laser welding is performed by irradiating a laser beam to a objected joint portion of metals adjacently arranged, the irradiation of the laser beam is terminated after power of the laser beam is reduced in comparison with an irradiation starting time without constantly setting the power of the laser beam from the irradiation start to the irradiation termination. When the power of the laser beam is constant from the irradiation start to the irradiation termination, the metals melted by the irradiation of the laser beam are suddenly cooled and solidified by the irradiation termination of the laser beam so that various problems are caused. In contrast to this, the sudden cooling solidification of the molten metals can be restrained by terminating the irradiation of the laser beam after the power of the laser beam is reduced. Thus, it is possible to reduce the generation of a crack and an air bubble in a welding portion. Further, residual stress of the welding portion can be reduced and restrained. |
| 公开日期 | 2002-12-26 |
| 申请日期 | 2002-06-14 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/52753]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | FURUKAWA ELECTRIC CO., LTD, THE |
| 推荐引用方式 GB/T 7714 | SEKIGUCHI, KAORU. Laser welding method and semiconductor laser module manufactured by this method. US20020195432A1. 2002-12-26. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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