Chip carrier apparatus and method
文献类型：专利
| 作者 | KOZLOVSKY, WILLIAM J.; DAIBER, ANDREW J.; SAWYER, KEVIN A. |
| 发表日期 | 2003-12-18 |
| 专利号 | US20030231669A1 |
| 著作权人 | INTEL CORPORATION |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Chip carrier apparatus and method |
| 英文摘要 | A chip carrier having improver thermal properties, wherein the chip carrier may be formed having waist section, and a first transverse end portion joined to the waist section. A first surface of the carrier being configured to receive a chip thereon, and a second surface of the carrier configured to be coupled to a thermal control unit to provide cooling of the carrier and chip. The chip carrier may have a second transverse end portion joined to the waist portion in certain embodiments. |
| 公开日期 | 2003-12-18 |
| 申请日期 | 2002-06-15 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/52754]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | INTEL CORPORATION |
| 推荐引用方式 GB/T 7714 | KOZLOVSKY, WILLIAM J.,DAIBER, ANDREW J.,SAWYER, KEVIN A.. Chip carrier apparatus and method. US20030231669A1. 2003-12-18. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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