Ceramic waferboard
文献类型:专利
作者 | BOUDREAU, ROBERT A; TAN, SONGSHENG |
发表日期 | 2003-05-19 |
专利号 | AU2002331855A1 |
著作权人 | CORNING INCORPORATED |
国家 | 澳大利亚 |
文献子类 | 发明申请 |
其他题名 | Ceramic waferboard |
英文摘要 | An optoelectronic module 1 includes a ceramic waferboard 2 having a groove 3 configured to passively position an optical fiber 4. The ceramic waferboard 2 includes an alignment feature configured to passively position an optical component. An optical device 8 is secured to the ceramic waferboard 2 in contact with the alignment feature to thereby position the optical device 8. An optical fiber 4 is positioned in the groove 3 with an end of the optical fiber 4 positioned adjacent the optical device 8 to thereby optically couple the optical fiber 4 to the optical device 8. The optoelectronic module 1 also includes an integrated circuit chip 11 secured to the ceramic waferboard 2, and a conductive material disposed on the ceramic waferboard 2 and electrically coupling the integrated circuit chip 11 to the optical device 8. |
公开日期 | 2003-05-19 |
申请日期 | 2002-09-13 |
状态 | 失效 |
源URL | [http://ir.opt.ac.cn/handle/181661/52837] ![]() |
专题 | 半导体激光器专利数据库 |
作者单位 | CORNING INCORPORATED |
推荐引用方式 GB/T 7714 | BOUDREAU, ROBERT A,TAN, SONGSHENG. Ceramic waferboard. AU2002331855A1. 2003-05-19. |
入库方式: OAI收割
来源:西安光学精密机械研究所
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