Thermal circuitry
文献类型：专利
| 作者 | LAM, YEE LOY; TEO, KIAN HIN VICTOR; CHA, CHER LIANG RANDALL; GOH, THENG THENG |
| 发表日期 | 2003-06-12 |
| 专利号 | US20030107114A1 |
| 著作权人 | DENSELIGHT SEMICONDUCTORS PTE LTD. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Thermal circuitry |
| 英文摘要 | In the present invention, an assembly comprises one or more semiconductor optoelectronic devices sandwiched between two substrates with thermal circuitry so to provide a route by which heat can be transported from both the n-side and p-side of the semiconductor device to a cooling element. The arrangement proposed is robust, benefiting from the stability and flexibility of component integration provide by simultaneous n and p-side down configuration. The arrangement also allows a large thermal gradient to be achieved with respect to the active region of an optoelectronic device from both the n-side and p-side, resulting in fast and efficient heat spreading. |
| 公开日期 | 2003-06-12 |
| 申请日期 | 2002-10-08 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/52871]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | DENSELIGHT SEMICONDUCTORS PTE LTD. |
| 推荐引用方式 GB/T 7714 | LAM, YEE LOY,TEO, KIAN HIN VICTOR,CHA, CHER LIANG RANDALL,et al. Thermal circuitry. US20030107114A1. 2003-06-12. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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