Cooling device for laser diodes
文献类型：专利
| 作者 | NAGANO, KAZUHIKO; OKAZAKI, YOJI |
| 发表日期 | 2003-05-08 |
| 专利号 | US20030086454A1 |
| 著作权人 | FUJIFILM CORPORATION |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Cooling device for laser diodes |
| 英文摘要 | A cooling device for laser diodes comprising a stem which comprises a 2 mm thick Cu substrate having thereon an array of grooves extending to the resonator length of a laser diode device with a width of 50 mum and a depth of 300 mum and a 100 mum thick Cu cover plate for hermetically sealing the grooved surface by, e.g. soldering. The groove contains a working fluid of deionized water filled under reduced pressure, forming a heat pipe. A plurality of heat pipes is created to form a heat pipe array. Forty GaN laser diode devices each having five light-emitting areas, each of which has an optical power of 100 mW, are mounted with junction-down on the upper surface of cover plate, forming a bar laser with a total output of approximately 20 W. |
| 公开日期 | 2003-05-08 |
| 申请日期 | 2002-10-15 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/52879]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | FUJIFILM CORPORATION |
| 推荐引用方式 GB/T 7714 | NAGANO, KAZUHIKO,OKAZAKI, YOJI. Cooling device for laser diodes. US20030086454A1. 2003-05-08. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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