Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it
文献类型：专利
| 作者 | YOSHIDA, KATSUHITO; MORIGAMI, HIDEAKI; AWAJI, TAKAHIRO; NAKAI, TETSUO |
| 发表日期 | 2005-03-10 |
| 专利号 | US20050051891A1 |
| 著作权人 | SUMITOMO ELECTRIC INDUSTRIES, LTD |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it |
| 英文摘要 | This invention relates to a high thermal conductivity composite material which comprises diamond particles and a copper matrix useful as electronic heat sinks for electronics parts, particularly for semiconductor lasers, high performance MPUs (micro-processing units), etc., also to a process for the production of the same and a heat sink using the same. According to the high thermal conductivity diamond sintered compact of the present invention, in particular, there can be provided a heat sink having a high thermal conductivity as well as matching of thermal expansions, most suitable for mounting a large sized and high thermal load semiconductor chip, for example, high output semiconductor lasers, high performance MPU, etc. Furthermore, the properties such as thermal conductivity and thermal expansion can freely be controlled, so it is possible to select the most suitable heat sink depending upon the features and designs of elements to be mounted. |
| 公开日期 | 2005-03-10 |
| 申请日期 | 2002-10-16 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/52886]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SUMITOMO ELECTRIC INDUSTRIES, LTD |
| 推荐引用方式 GB/T 7714 | YOSHIDA, KATSUHITO,MORIGAMI, HIDEAKI,AWAJI, TAKAHIRO,et al. Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it. US20050051891A1. 2005-03-10. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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