Self-aligned metal base/window cap and methods of aligning a laser diode chip to a window cap for high speed semiconductor laser package
文献类型：专利
| 作者 | PENG, HUEI; LIANG, BINGWEN |
| 发表日期 | 2004-04-22 |
| 专利号 | US20040076383A1 |
| 著作权人 | PENG HUEI |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Self-aligned metal base/window cap and methods of aligning a laser diode chip to a window cap for high speed semiconductor laser package |
| 英文摘要 | Metal bases and window caps are used for semiconductor laser diode transistor-outline (TO) type packages and the like. New types of metal bases and window caps are disclosed. Tapered metal bases of the present invention works with tapered window caps of the present invention to function as a self-alignment mechanism of them, which is especially important for the ball lens window caps. The self-aligned tapered metal bases and tapered window caps provide a more productive (high yield), cost effective, and accurate means to manufacture semiconductor laser diode packages, which is a key factor for high-speed semiconductor laser diode application. The top surface of a metal base of the present invention has at least two fiducial marks designed to serve as the reference for the process automatic equipment to search and define the center of the metal base. These references will improve the accuracy of process equipment placing the laser diode chip and/or dispensing adhesive. To simplify the wire bonding process and make it robust, a two-bonding-surface post and a tilted-top post are disclosed in the present invention to eliminate the rotation process between two sequential bonding steps. |
| 公开日期 | 2004-04-22 |
| 申请日期 | 2002-10-17 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/52889]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | PENG HUEI |
| 推荐引用方式 GB/T 7714 | PENG, HUEI,LIANG, BINGWEN. Self-aligned metal base/window cap and methods of aligning a laser diode chip to a window cap for high speed semiconductor laser package. US20040076383A1. 2004-04-22. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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