Optoelectronic package and fabrication method
文献类型：专利
| 作者 | SAIA, RICHARD JOSEPH; GORCZYCA, THOMAS BERT; KAPUSTA, CHRISTOPHER JAMES; BALCH, ERNEST WAYNE; CLAYDON, GLENN SCOTT; DASGUPTA, SAMHITA; DELGADO, ELADIO CLEMENTE |
| 发表日期 | 2004-04-22 |
| 专利号 | US20040076382A1 |
| 著作权人 | GENERAL ELECTRIC COMPANY |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Optoelectronic package and fabrication method |
| 英文摘要 | An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate active-side up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device. |
| 公开日期 | 2004-04-22 |
| 申请日期 | 2002-10-21 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/52891]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | GENERAL ELECTRIC COMPANY |
| 推荐引用方式 GB/T 7714 | SAIA, RICHARD JOSEPH,GORCZYCA, THOMAS BERT,KAPUSTA, CHRISTOPHER JAMES,et al. Optoelectronic package and fabrication method. US20040076382A1. 2004-04-22. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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