Multi-layer printed circuit board and the method for coupling optical signals between layers of multi-layer printed circuit board
文献类型：专利
| 作者 | KIM, YOUNG-WOO; RHEE, BYOUNG-HO; YANG, DEK-GIN; CHO, YOUNG-SANG; YIM, KYU-HYOK |
| 发表日期 | 2004-06-10 |
| 专利号 | US20040109628A1 |
| 著作权人 | SAMSUNG ELECTRO-MECHANICS CO LTD |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Multi-layer printed circuit board and the method for coupling optical signals between layers of multi-layer printed circuit board |
| 英文摘要 | Disclosed herein is an optical signal coupling block, and a multi-layer printed circuit board and the method for coupling optical signals between layers of a multi-layer printed circuit board (PCB) using optical signal coupling blocks. The optical signals between the layers are coupled through the steps of forming a plurality of optical via holes in the multi-layer PCB to which optical waveguides for transmitting optical signals are attached; inserting the optical signal coupling blocks into the plural optical via holes such that the optical signal coupling blocks are connected to the optical waveguides to transmit the optical signals; forming at least one connection part to couple optical signals between the optical waveguides and the optical signal coupling blocks; and interconnecting the optical waveguides and the optical signal coupling blocks by aligning positions of the optical waveguides and the optical signal coupling blocks. |
| 公开日期 | 2004-06-10 |
| 申请日期 | 2003-04-16 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53001]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SAMSUNG ELECTRO-MECHANICS CO LTD |
| 推荐引用方式 GB/T 7714 | KIM, YOUNG-WOO,RHEE, BYOUNG-HO,YANG, DEK-GIN,et al. Multi-layer printed circuit board and the method for coupling optical signals between layers of multi-layer printed circuit board. US20040109628A1. 2004-06-10. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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