Semiconductor array device with single interconnection layer
文献类型：专利
| 作者 | FUJIWARA, HIROYUKI; TANINAKA, MASUMI; OZAWA, SUSUMU; KOIZUMI, MASUMI |
| 发表日期 | 2004-02-25 |
| 专利号 | EP1391936A2 |
| 著作权人 | OKI DATA CORPORATION |
| 国家 | 欧洲专利局 |
| 文献子类 | 发明申请 |
| 其他题名 | Semiconductor array device with single interconnection layer |
| 英文摘要 | An array of semiconductor circuit elements such as light-emitting elements includes a semiconductor layer partially covered by a dielectric film. A first interconnecting pad such as a wire-bonding pad is electrically coupled by conductive paths passing through the semiconductor layer to electrodes of a first group of semiconductor circuit elements formed in the semiconductor layer. A second interconnecting pad such as a wire-bonding pad, formed on the dielectric film, is electrically coupled to electrodes of a second group of semiconductor circuit elements formed in the semiconductor layer by conductive paths insulated from the semiconductor layer by the dielectric film. The second conductive paths cross the first conductive paths at points at which the first conductive paths pass through the semiconductor layer, so that only a single layer of metal interconnecting lines is needed. |
| 公开日期 | 2004-02-25 |
| 申请日期 | 2003-07-31 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53088]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | OKI DATA CORPORATION |
| 推荐引用方式 GB/T 7714 | FUJIWARA, HIROYUKI,TANINAKA, MASUMI,OZAWA, SUSUMU,et al. Semiconductor array device with single interconnection layer. EP1391936A2. 2004-02-25. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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