Package for housing semiconductor chip, and semiconductor device
文献类型：专利
| 作者 | SAITO, HIROHISA; TSUNO, TAKASHI; KAWAI, CHIHIRO; TANAKA, MOTOYOSHI |
| 发表日期 | 2004-09-23 |
| 专利号 | US20040183172A1 |
| 著作权人 | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Package for housing semiconductor chip, and semiconductor device |
| 英文摘要 | The present invention provides a semiconductor package allowing a semiconductor chip to be operated accurately and with high stability over a long period by effectively transferring the heat generated during the operation of the semiconductor chip to a heat sink. A package for housing a semiconductor chip comprises a substrate 2 having on the upper surface thereof a mounting space where a semiconductor chip 1 is to be mounted, a frame 3 being provided so as to surround the mounting space on the upper surface of the substrate 2 and having a joint 3a for an input/output terminal 5 on the side, and an input/output terminal 5 connected to the joint 3a, wherein the substrate 2, or part of the substrate 2, or the substrate 2 and the frame 3, or part of the substrate and the frame is formed from a metal-diamond composite in which a matrix material having diamond particles joined via a metal carbide is infiltrated with a copper and/or silver or a metal-diamond sintered body composed of diamond particles and copper. Further, the surface of the metal-diamond composite is plated with gold. |
| 公开日期 | 2004-09-23 |
| 申请日期 | 2003-10-07 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53159]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| 推荐引用方式 GB/T 7714 | SAITO, HIROHISA,TSUNO, TAKASHI,KAWAI, CHIHIRO,et al. Package for housing semiconductor chip, and semiconductor device. US20040183172A1. 2004-09-23. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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