Methods of assembling leadless packages for image sensor devices
文献类型：专利
| 作者 | BOON, SUAN JEUNG; CHIA, YONG POO; NEO, YONG LOO; CHUA, SWEE KWANG; LOW, SIU WAF |
| 发表日期 | 2004-05-06 |
| 专利号 | US20040084741A1 |
| 著作权人 | MICRON TECHNOLOGY, INC. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Methods of assembling leadless packages for image sensor devices |
| 英文摘要 | A leadless image sensor package and methods for its assembly. In a first embodiment, an image sensor chip is mounted within a bottom-side cavity of a package shell in a flip-chip manner such that sensing circuitry on the image sensor chip is exposed through an aperture in the top side of the package shell. A transparent encapsulant material is deposited within the aperture to encase interconnect bonds between the package shell and the image sensor chip. A transparent lid is held in place over the aperture by the encapsulant material. The back surface of the image sensor chip is left exposed. In a second embodiment particularly suitable for high-end image sensors, an encapsulant material is not required. Instead, a backing cap is hermetically sealed to a ledge surface in the package shell to cover the bottom-side cavity. A compression member formed on the backing cap contacts the image sensor chip and maintains interconnect bond integrity. |
| 公开日期 | 2004-05-06 |
| 申请日期 | 2003-10-23 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53167]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | MICRON TECHNOLOGY, INC. |
| 推荐引用方式 GB/T 7714 | BOON, SUAN JEUNG,CHIA, YONG POO,NEO, YONG LOO,et al. Methods of assembling leadless packages for image sensor devices. US20040084741A1. 2004-05-06. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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