Semiconductor light-emitting device and method of manufacturing the same and mounting plate
文献类型：专利
| 作者 | OZAWA, MASAFUMI |
| 发表日期 | 2005-02-17 |
| 专利号 | US20050035176A1 |
| 著作权人 | SONY CORPORATION |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Semiconductor light-emitting device and method of manufacturing the same and mounting plate |
| 英文摘要 | To offer a semiconductor light-emitting device capable of preventing a short circuit failure caused by adhesion of the solder, change of a beam shape, and decrease of a beam output. A semiconductor laser device 1 is manufactured by overlaying a laser chip having a p-side electrode and a n-side electrode in a crystalline substrate and a mounting plate having a first solder film and a second solder film in a supporting body. The laser chip has a level difference A such that the p-side electrode is projected beyond the n-side electrode. The mounting plate has a level difference B such that the first solder film is projected beyond the second solder film. The level difference B of the mounting plate is determined as higher than the level difference A of the laser chip. Therefore, when the mounting plate is overlaid to the laser chip, first, the n-side electrode contacts with the second solder film, and then, the p-side electrode contacts the first solder film. Accordingly, even if the solder is squeezed out in the vicinity of the n-side electrode, the solder is hardly squeezed out in the vicinity of the p-side electrode. The pn junction part is generally positioned in the vicinity of the p-side electrode, which controls the solder to adhesion to the pn junction part. |
| 公开日期 | 2005-02-17 |
| 申请日期 | 2003-12-18 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53217]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SONY CORPORATION |
| 推荐引用方式 GB/T 7714 | OZAWA, MASAFUMI. Semiconductor light-emitting device and method of manufacturing the same and mounting plate. US20050035176A1. 2005-02-17. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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