Mounting of a semiconductor laser device by soldering
文献类型：专利
| 作者 | SAKANO, TETSURO; TAKIGAWA, HIROSHI; NISHIKAWA, YUJI |
| 发表日期 | 2004-12-15 |
| 专利号 | EP1487073A2 |
| 著作权人 | FANUC LTD |
| 国家 | 欧洲专利局 |
| 文献子类 | 发明申请 |
| 其他题名 | Mounting of a semiconductor laser device by soldering |
| 英文摘要 | A semiconductor laser (3) has emitters (7) that are separated by LD stripes (6). Grooves (2) are formed in a mounting substrate (1) corresponding to both ends of the semiconductor laser (3). On mounting, fillets (9) are formed in the grooves (2) by molten solder, thereby reinforcing the soldering at both ends of the semiconductor laser (3) and enabling uniform bonding strength to be achieved. |
| 公开日期 | 2004-12-15 |
| 申请日期 | 2004-06-08 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53354]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | FANUC LTD |
| 推荐引用方式 GB/T 7714 | SAKANO, TETSURO,TAKIGAWA, HIROSHI,NISHIKAWA, YUJI. Mounting of a semiconductor laser device by soldering. EP1487073A2. 2004-12-15. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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