Thermal interposer for cooled electrical packages
文献类型：专利
| 作者 | CORONATI, JOHN M.; DERKITS, GUSTAV EDWARD JR.; DAUGHERTY, DAVID; FUCHS, CHRISTOPHER; GEARY, JOHN M.; LISCHNER, DAVID J. |
| 发表日期 | 2006-01-12 |
| 专利号 | US20060006526A1 |
| 著作权人 | CORONATI JOHN M |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Thermal interposer for cooled electrical packages |
| 英文摘要 | The specification describes electrical assemblies comprising actively cooled components wherein a thermal interposer is used to limit heat transfer between the ambient and the cooled components. The thermal interposer is effective for transmitting signals for both power/ground and RF. Structurally, the thermal interposer comprises thin conductors in various configurations that convey electrical signals but significantly limit heat flow. |
| 公开日期 | 2006-01-12 |
| 申请日期 | 2004-07-06 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53372]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | CORONATI JOHN M |
| 推荐引用方式 GB/T 7714 | CORONATI, JOHN M.,DERKITS, GUSTAV EDWARD JR.,DAUGHERTY, DAVID,et al. Thermal interposer for cooled electrical packages. US20060006526A1. 2006-01-12. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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