Interface module-mounted LSI package
文献类型：专利
| 作者 | FURUYAMA, HIDETO; HAMASAKI, HIROSHI |
| 发表日期 | 2005-10-20 |
| 专利号 | US20050231911A1 |
| 著作权人 | KABUSHIKI KAISHA TOSHIBA |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Interface module-mounted LSI package |
| 英文摘要 | An interface module-mounted LSI package has an interposer equipped with a signal processing LSI, an interface module for signal transmission, mechanically connected to the interposer and electrically connected to the signal processing LSI, and a heat sink which is in contact with both the signal processing LSI and the interface module, and radiates heat of the signal processing LSI and the interface module. The LSI package has a gap, which serves as a heat resistor portion between the heat radiating portion for the signal processing LSI and the heat radiating portion for the interface module. |
| 公开日期 | 2005-10-20 |
| 申请日期 | 2004-08-18 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53401]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | KABUSHIKI KAISHA TOSHIBA |
| 推荐引用方式 GB/T 7714 | FURUYAMA, HIDETO,HAMASAKI, HIROSHI. Interface module-mounted LSI package. US20050231911A1. 2005-10-20. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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