Low thermal expansion coefficient cooler for diode-laser bar
文献类型：专利
| 作者 | CARTER, SERRENA M.; MARTINSEN, ROBERT |
| 发表日期 | 2006-03-02 |
| 专利号 | US20060045153A1 |
| 著作权人 | COHERENT, INC. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Low thermal expansion coefficient cooler for diode-laser bar |
| 英文摘要 | A heat sink for cooling a diode-laser bar on a gallium arsenide (GaAs) substrate includes a water-cooled copper body. A layer of a metal having a coefficient of expansion (CTE) about equal to or greater than that of gallium arsenide but less than that of copper is bonded to each of two opposite surfaces of the body. A layer of copper is bonded each of the lower-CTE layers. The copper layers each have a thickness less than that of the lower-CTE layers and are under tensile strain. This provides that when a GaAs diode-laser bar is soldered to the heat sink the copper layers do not expand any more than the lower-CTE layers differential expansion between the copper and the lower CTE material merely reduces the tensile strain in the layers. |
| 公开日期 | 2006-03-02 |
| 申请日期 | 2004-08-31 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53416]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | COHERENT, INC. |
| 推荐引用方式 GB/T 7714 | CARTER, SERRENA M.,MARTINSEN, ROBERT. Low thermal expansion coefficient cooler for diode-laser bar. US20060045153A1. 2006-03-02. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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