Cooling device for semiconductor component
文献类型：专利
| 作者 | SAKANO, TETSURO; TAKIGAWA, HIROSHI; NISHIKAWA, YUJI; HAYANO, KOJI; OHYAMA, AKINORI; MIYATA, RYUSUKE |
| 发表日期 | 2005-06-30 |
| 专利号 | US20050141574A1 |
| 著作权人 | FANUC LTD |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Cooling device for semiconductor component |
| 英文摘要 | A cooling device for a semiconductor component which increases mechanical strength thereof and reduces a pressure loss of coolant. Plate members constituting the cooling device are formed with flow passages such as coolant supply and discharge openings, grooves divided by ridges, and through portions separated by projections or partitions. The ridges, projections, and partitions are joined to a adjacent plate member to increase the joining strength, which is further increased by forming the ridges, projections, and partitions of different plate members at the same positions. In the case of laminating the plate members having surfaces formed with solder layers, a number of minute vacant spaces are formed in those joining faces of the plate members which are not formed with passages, etc., and solder filets are formed over the entire joining faces to increase the joining strength. The grooves and through portions can be formed by chemical etching together with outer shapes of the plate members. A plurality of plate members can be fabricated from a single sheet material at a time. |
| 公开日期 | 2005-06-30 |
| 申请日期 | 2004-09-03 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53419]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | FANUC LTD |
| 推荐引用方式 GB/T 7714 | SAKANO, TETSURO,TAKIGAWA, HIROSHI,NISHIKAWA, YUJI,et al. Cooling device for semiconductor component. US20050141574A1. 2005-06-30. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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