Light emitting device assembly
文献类型：专利
| 作者 | KWAK, JOON-SEOP; KIM, JONG-WAN; CHAE, SU-HEE |
| 发表日期 | 2005-04-07 |
| 专利号 | US20050072984A1 |
| 著作权人 | SAMSUNG ELECTRONICS CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Light emitting device assembly |
| 英文摘要 | Provided is a light emitting device assembly. The light emitting device assembly includes a submount including bumps, each having a bonded surface and a lateral surface surrounding the bonded surface; and a light emitting device including pads, each having a bonded surface corresponding to a bonded surface of a corresponding bump. Herein, edges of the bonded surface of each of the bumps are spaced a predetermined distance inward from edges of a corresponding pad. |
| 公开日期 | 2005-04-07 |
| 申请日期 | 2004-09-13 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53428]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SAMSUNG ELECTRONICS CO., LTD. |
| 推荐引用方式 GB/T 7714 | KWAK, JOON-SEOP,KIM, JONG-WAN,CHAE, SU-HEE. Light emitting device assembly. US20050072984A1. 2005-04-07. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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