Light emission device and manufacturing method thereof
文献类型：专利
| 作者 | MIZUYOSHI, AKIRA |
| 发表日期 | 2005-03-17 |
| 专利号 | US20050057939A1 |
| 著作权人 | FUJI PHOTO FILM CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Light emission device and manufacturing method thereof |
| 英文摘要 | A light emission device is constituted of LED chips, a driver circuit, and a wiring pattern for connecting the individual LED chips to the driver circuit. The wiring pattern is formed by weaving line members into a cross grid, the line member being formed by coating an electro conductive core with an isolating material. The lateral line members are connected to a negative electrode of the driver circuit, while the longitudinal line members are connected to a positive electrode of the driver circuit. Connectors are formed at cross points between the line members Negative poles of the LED chips are connected to the connectors that are formed on the lateral line members, while positive poles of the LED chips are connected to the connectors that are formed on the longitudinal line members. The wiring pattern is affixed to a heat sink through an adhesive agent. |
| 公开日期 | 2005-03-17 |
| 申请日期 | 2004-09-14 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53433]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | FUJI PHOTO FILM CO., LTD. |
| 推荐引用方式 GB/T 7714 | MIZUYOSHI, AKIRA. Light emission device and manufacturing method thereof. US20050057939A1. 2005-03-17. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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