Power led package
文献类型：专利
| 作者 | DU, SHAWN X. |
| 发表日期 | 2006-04-06 |
| 专利号 | US20060071329A1 |
| 著作权人 | GELCORE, LLC |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Power led package |
| 英文摘要 | In a chip package (10, 10′, 110, 210), first and second electrical power buses (14, 14′, 16, 16′, 114, 116, 214, 216) are each formed of an electrical conductor having a chip bonding portion (20, 22, 120, 122, 220, 222) and a lead portion (26, 26′, 28, 28′, 126, 128, 226, 228) extending away from the chip bonding portion. The chip bonding portions of the first and second electrical power buses have edges (32, 34, 132, 134, 232, 234) spaced apart from one another to define an extended electrical isolation gap (40, 140, 240). A plurality of chips (42, 44, 46, 142, 143, 144, 145, 146, 147, 148, 242) straddle the extended electrical isolation gap and are electrically connected with the first and second electrical power buses to receive electrical power from the first and second electrical power buses. |
| 公开日期 | 2006-04-06 |
| 申请日期 | 2004-09-24 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53442]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | GELCORE, LLC |
| 推荐引用方式 GB/T 7714 | DU, SHAWN X.. Power led package. US20060071329A1. 2006-04-06. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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