Epoxy/silicone mixed resin composition and light-emitting semiconductor device
文献类型:专利
| 作者 | KASHIWAGI, TSUTOMU; SHIOBARA, TOSHIO |
| 发表日期 | 2005-06-16 |
| 专利号 | US20050129957A1 |
| 著作权人 | SHIN-ETSU CHEMICAL CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Epoxy/silicone mixed resin composition and light-emitting semiconductor device |
| 英文摘要 | An epoxy/silicone mixed resin composition comprising (A′) an organosilicon compound containing at least one aliphatic unsaturated monovalent hydrocarbon group and at least one silicon atom-bonded hydroxyl group, (B) an epoxy resin containing at least one epoxy group, (C) an organohydrogenpolysiloxane, (D) a platinum group metal-based catalyst, and (E) an aluminum-based curing catalyst is used to encapsulate a light-emitting semiconductor member. The light-emitting semiconductor device undergoes little discoloration in a heat test, and has a high emission efficiency, a long life and reduced energy consumption. |
| 公开日期 | 2005-06-16 |
| 申请日期 | 2004-11-18 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53473] ![]() |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SHIN-ETSU CHEMICAL CO., LTD. |
| 推荐引用方式 GB/T 7714 | KASHIWAGI, TSUTOMU,SHIOBARA, TOSHIO. Epoxy/silicone mixed resin composition and light-emitting semiconductor device. US20050129957A1. 2005-06-16. |
入库方式: OAI收割
来源:西安光学精密机械研究所
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