Semiconductor light emitting device mounting substrates and packages including cavities and cover plates, and methods of packaging same
文献类型：专利
| 作者 | NEGLEY, GERALD H.; SLATER, DAVID B. JR. |
| 发表日期 | 2006-06-15 |
| 专利号 | US20060124953A1 |
| 著作权人 | CREE, INC. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Semiconductor light emitting device mounting substrates and packages including cavities and cover plates, and methods of packaging same |
| 英文摘要 | A mounting substrate for a semiconductor light emitting device includes a solid metal block having first and second opposing metal faces. The first metal face includes a cavity that is configured to mount at least one semiconductor light emitting device therein, and to reflect light that is emitted by at least one semiconductor light emitting device that is mounted therein away from the cavity. One or more semiconductor light emitting devices are mounted in the cavity. A cap having an aperture is configured to matingly attach to the solid metal block adjacent the first metal face such that the aperture is aligned to the cavity. Reflective coatings, conductive traces, insulating layers, pedestals, through holes, lenses, flexible films, optical elements, phosphor, integrated circuits, optical coupling media, recesses and/or meniscus control regions also may be provided in the package. Related packaging methods also may be provided. |
| 公开日期 | 2006-06-15 |
| 申请日期 | 2004-12-14 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53497]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | CREE, INC. |
| 推荐引用方式 GB/T 7714 | NEGLEY, GERALD H.,SLATER, DAVID B. JR.. Semiconductor light emitting device mounting substrates and packages including cavities and cover plates, and methods of packaging same. US20060124953A1. 2006-06-15. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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