Optimized contact design for thermosonic bonding of FLIP-chip devices
文献类型：专利
| 作者 | ELIASHEVICH, IVAN; VENUGOPALAN, HARI, S.; GOA, XIANG; SACKRISON, MICHAEL, J. |
| 发表日期 | 2005-07-21 |
| 专利号 | WO2005065325A2 |
| 著作权人 | GELCORE LLC |
| 国家 | 世界知识产权组织 |
| 文献子类 | 发明申请 |
| 其他题名 | Optimized contact design for thermosonic bonding of FLIP-chip devices |
| 英文摘要 | A light emitting device (A) includes a semiconductor die (100). The semiconductor die includes: an epitaxial structure (120) arranged on a substrate (160), the epitaxial structure forming an active light generating region (140) between a first layer (120n) on a first side of the active region and having a first conductivity type, and a second layer (120p) on a second side of the active region and having a second conductivity type, the second side of the active region being opposite the first side of the active region and the second conductivity type being different that the first conductivity type; a first contact (180n) in operative electrical communication with the active region via the first layer in the epitaxial structure, the first contact being arranged on a side of the epitaxial structure opposite the substrate; a second contact (180p) in operative electrical communication with the active region via the second layer in the epitaxial structure, the second contact being arranged on a side of the epitaxial structure opposite the substrate; a first contact trace corresponding to the first contact and defined at a surface thereof distal from the substrate, the first trace including at least one area designated for bonding (320n); and, a second contact trace corresponding the second contact and defined at a surface thereof distal from the substrate, the second trace including at least one area (320p) designated for bonding. Suitably, the first contact trace is substantially enclosed within the second contact trace. |
| 公开日期 | 2005-07-21 |
| 申请日期 | 2004-12-22 |
| 状态 | 未确认 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/53511]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | GELCORE LLC |
| 推荐引用方式 GB/T 7714 | ELIASHEVICH, IVAN,VENUGOPALAN, HARI, S.,GOA, XIANG,et al. Optimized contact design for thermosonic bonding of FLIP-chip devices. WO2005065325A2. 2005-07-21. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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