中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Optimized contact design for thermosonic bonding of FLIP-chip devices

文献类型:专利

作者ELIASHEVICH, IVAN; VENUGOPALAN, HARI, S.; GOA, XIANG; SACKRISON, MICHAEL, J.
发表日期2005-07-21
专利号WO2005065325A2
著作权人GELCORE LLC
国家世界知识产权组织
文献子类发明申请
其他题名Optimized contact design for thermosonic bonding of FLIP-chip devices
英文摘要A light emitting device (A) includes a semiconductor die (100). The semiconductor die includes: an epitaxial structure (120) arranged on a substrate (160), the epitaxial structure forming an active light generating region (140) between a first layer (120n) on a first side of the active region and having a first conductivity type, and a second layer (120p) on a second side of the active region and having a second conductivity type, the second side of the active region being opposite the first side of the active region and the second conductivity type being different that the first conductivity type; a first contact (180n) in operative electrical communication with the active region via the first layer in the epitaxial structure, the first contact being arranged on a side of the epitaxial structure opposite the substrate; a second contact (180p) in operative electrical communication with the active region via the second layer in the epitaxial structure, the second contact being arranged on a side of the epitaxial structure opposite the substrate; a first contact trace corresponding to the first contact and defined at a surface thereof distal from the substrate, the first trace including at least one area designated for bonding (320n); and, a second contact trace corresponding the second contact and defined at a surface thereof distal from the substrate, the second trace including at least one area (320p) designated for bonding. Suitably, the first contact trace is substantially enclosed within the second contact trace.
公开日期2005-07-21
申请日期2004-12-22
状态未确认
源URL[http://ir.opt.ac.cn/handle/181661/53511]  
专题半导体激光器专利数据库
作者单位GELCORE LLC
推荐引用方式
GB/T 7714
ELIASHEVICH, IVAN,VENUGOPALAN, HARI, S.,GOA, XIANG,et al. Optimized contact design for thermosonic bonding of FLIP-chip devices. WO2005065325A2. 2005-07-21.

入库方式: OAI收割

来源:西安光学精密机械研究所

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